TMGSiP · THz Muti-Gb/s System in Package

THz Muti-Gb/s System in Package

The goal of "THz Muti-Gb/s System in Package", i.e., "TMGSiP" project is to develop a fully integrated 120GHz radio front-end for Multi-Gb/s radio links with state-of-the-art SiGe BiCMOS technology. This will be done with a completely new cross-cutting design methodology for silicon-MMIC, e.g. the development of wideband receiver and transmitter, including on-chip antenna and novel packaging concepts. This will enable a big improvement in the functionality (complexity of RF MMICs), performance (data rate), component size (fully-integrated compact MMIC with integrated antennas), power consumption and cost over existing III/V communication systems. The project’s ambition is to realize a sub-THz Si analog front-end with integrated antennas for a line of sight communication link with data rates even up to 40Gbps centered around 120GHz bandwidth of 20GHz and range up to a few meters. Due to the huge available bandwidth only simple low-order modulation schemes like QPSK will be considered. Due to the termination of the project only first building blocks of the wideband transmitter and receiver were designed, fabricated and characterized. Also some preliminary design work of the other building components has been carried out.

Data: CORDIS, © European Union