Study and optimization of gold plating processes

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Project objective

Research objectives and content The objective of this project is to study and optimize existing industrial gold plating pro- -cesses of wafers such that the treated components on it meet the required quality at reaso nable cost. The following research steps are considered: - study of known and available wafer plating cells through analysis and measurements, - application and evaluation of the dilute solution model" - solver, developed by the applicant during the BE92-5 187 project and continued in the BE95- 1232 project, - optimization of cell geometries, electrode configurations, flow conditions, ... using the model, realization of optimal designed cells and practical evaluation. Training content (objective, benefit and expected impact) During the project many practical problems and limitations of a real industrial plating pro- cess will be encountered. These are complementary to the firm theoretical knowledge of the applicaht such that he will become a highly qualified electrochernical design- engineer. Members of the host will acquire better theoretical insight and tools to improve their processes. Links with industry / industrial relevance (22) The research is directly related to gold plating of electronic components. When success- ful, the methodology and obtained results will enable improvements of many other plated products. "

Original text from CORDIS.

Participants

• Philips Plastic and Metalware Factory's Netherlands B.V. · EindhovenCoordinatorNetherlands
• Not availableCity levelBelgium

Links

• View on CORDIS