H2020Индивидуална стипендия2021–2022

TECTONIC · Towards Employing Compilers for Thermal Management and Optimal Data Placement in Hybrid Cache

„Хоризонт 2020“ — Действия „Мария Склодовска-Кюри“

Период: 2021-01-01 → 2022-12-31
Финансиране от ЕС: 214 159 €
Участници: 1
Схема: MSCA-IF

Линиите свързват координатора с партньорите.

Накратко на български

Хибридните кешове на процесорите се анализират, за да се разпределят данните по-ефективно при тежки изчисления, като например обработка на мултимедия. Това помага за намаляване на прегряването на чиповете и удължаване на живота на паметта в бъдещите компютърни системи.

Този кратък обзор е генериран от изкуствен интелект

Кратко обяснение, генерирано от езиков модел по текста на CORDIS. Оригиналът е по-долу.

Резултати накратко

Towards Employing Compilers for Thermal Management and Optimal Data Placement in Hybrid Cache

TECTONIC manages the on-chip temperature by leveraging application specific knowledge extracted at compile time in combination with new hardware mechanisms to distribute cache accesses to mitigate thermal imbalance and to reduce write endurance while maintaining high performance. Specifically, TECTONIC will meet the following objectives: (1) To establish a relationship between data accesses and hot-spots at the CPU registers by investigating compute-intensive loops of contemporary large-scale applications (e.g., multi-media based applications, heavy algebraic computation etc.). (2) To employ loop splitting towards ameliorating the write endurance problem in NVMs. (3) To investigate the benefits of dynamic swapping of the contents of cache ways based upon write intensity. (4) The knowledge deduced by the above investigations will enable us to analyse PowerPerformance-Thermal trade-offs and develop an optimal thermal-aware data placement strategy for NVM-based hybrid cache. Additionally, the unavailability of proper architectural thermal simulators that can simulate the thermal behaviours of NVM-based hybrid caches keep this research area unexplored. Hence, the implementation of TECTONIC includes the creation of such a simulation framework, which will not only help us to accomplish the goals of TECTONIC, but will also kick off new research avenues. These solutions are necessary towards generating efficient next generation comuting systems, which is a prime need for modern society. By providing such solutions, in broader scale, TECTONIC directly contributes towards mitigating the sustainable development goal, named, Industry, Innovation and Infrastructure of UN, which can be leveraged to mitigate some other SDGs of UN like, Quality Education, Sustainable Cities and Communities, etc.

Текст от CORDIS, на английски · Данни: CORDIS, © Европейски съюз

Цел на проекта

The goal of the TECTONIC project is to alleviate the challenging problem of hot-spots in 3D stacked chip-multiprocessors by employing a software-hardware based combined approach. With the stagnation in process technology scaling new emerging memory technologies are investigated. Promise of better scalability with reduced static leakage makes Non-volatile memories (NVM) as the potential candidates to replace conventional SRAM. However, many of the proposed NVM technologies are sensitive to heat, that raised up the issue of reliability. Considering heat dissipation as an exclusive issue of hardware will not be the appropriate approach towards finding out the solutions, as running-application has direct impacts on on-chip thermal imbalance. Hence, TECTONIC will manage the on-chip temperature and eliminate hot-spots by leveraging application specific knowledge extracted at compile time in combination with new hardware mechanisms for distributing computational work and memory accesses for even heat distribution while maintaining high performance.

Оригинален текст от CORDIS (на английски).

Участници

NORGES TEKNISK-NATURVITENSKAPELIGE UNIVERSITET NTNU · TrondheimКоординаторНорвегия