SuperSolders · Designing high-reliability interconnection materials for accelerated modern electrification
„Хоризонт 2020“ — Действия „Мария Склодовска-Кюри“
- Период
- 2022-01-17 → 2024-01-16
- Финансиране от ЕС
- 224 934 €
- Участници
- 1
- Схема
- MSCA-IF
Линиите свързват координатора с партньорите.
Накратко на български
Нови материали за запояване, като галий и сплави с висок ентропиен състав, се тестват за свързване на електронни компоненти. Те помагат за създаването на по-надеждни устройства в автомобилния, космическия и потребителския сектор.
Кратко обяснение, генерирано от езиков модел по текста на CORDIS. Оригиналът е по-долу.
Резултати накратко
Designing high-reliability interconnection materials for accelerated modern electrification
This project was terminated at its early stage due to the departure of the Fellow Zhaolong Ma. This project was initially designed to explore novel solder materials for electronic interconnection applications in consumer electronics, automotive, aerospace, and power electronics industries, to address the problems of current materials, such as low performance and high costs. By the termination date of this project, we have explored the use of high entropy alloys (HEAs) and low melting temperature material (Gallium) as the substrate and interconnection materials respectively, to promote the formation of novel compositional complex intermetallics. We have carefully characterized the composed phases of the intermetallic layer and understood their formation mechanisms. New solders and understandings generated in this study will greatly contribute to developing next-generation high-reliability/performance electronic devices in consumer electronics, power electronics, and automotive/aerospace sector. The overall objectives are to design novel low-temperature solders, develop high-reliability solders for harsh environment applications, and explore novel TLPB (transient liquid phase bonding) solders for high-temperature applications. By the termination date of this project, we have explored Ga as a novel TLPB solder and HEAs as the TLPB substrates. This Ga/HEAs TLPB system demonstrated a good potential for industry application.
Текст от CORDIS, на английски · Данни: CORDIS, © Европейски съюз
Цел на проекта
The accelerated electrification in different sectors raises higher requirements on the reliability of electronics, which stimulates the demand for novel electronic interconnection materials. This proposed training-through-research aims to design new electronic interconnection materials to tackle three emerging bottlenecks in electronics manufacturing, which are i) low process-temperature solders to reduce energy consumption and facilitate 3D integration in consumer electronics, ii) high-reliability solders for harsh environments in the automotive and aerospace sectors, and iii) novel die-attach materials to enable the use of wide-bandgap power semiconductors. Advanced experiments and simulation techniques will be used to design novel solder alloys, study solidification microstructures, and evaluate the reliability and understand the deformation/failure mechanisms of solder joints. Comprehensive understandings on composition-processing-microstructure-property relationships will be built-up to drive the development of the three novel electronic interconnection materials in this project: i) novel multi-compositional low-temperature solders with refined microstructure and excellent ductility and strength superior to conventional Sn-Bi solders, ii) advanced high-reliability solders strengthened by mechanisms from microstructures of different scales including not only solid solutions and secondary phases but also grain structures and orientations that have not been incorporated by current solders, and iii) novel transient liquid phase bonding (TLPB) materials that can significantly reduce the processing time and produce refined high entropy intermetallic bonds with mechanical properties overmatching current TLPBs. This inter-/multi-disciplinary project promises a tremendous positive impact on the European consumer electronics, power electronics, and automotive and aerospace sectors, contributing to the European excellence, competitiveness, and quality of manufacturing.
Оригинален текст от CORDIS (на английски).
Участници
- IMPERIAL COLLEGE OF SCIENCE TECHNOLOGY AND MEDICINE · LondonКоординаторОбединеното кралство
Връзки
Данни: CORDIS, © Европейски съюз