ChipZnAirB · High-energy-density on-chip zinc-air batteries

Линиите свързват координатора с партньорите.

Накратко на български

Цел на проекта

The advent of smart dust, minuscule autonomous devices capable of sensing, processing, and transmitting data, has opened new frontiers in medicine, artificial intelligence (AI), and big data. However, their operation is significantly constrained by the limitations of existing power sources, particularly in terms of energy density and footprint, as was highlighted by the host [Nature, 2021, 589, 195]. This research proposal aims to address these challenges by developing a novel microbattery technology based on zinc-air chemistry. We propose a micro-origami approach to fabricate high-capacity, dust-sized zinc-air microbatteries. This method involves folding large-area thin films into three-dimensional (3D) structures by a micro-origami self-assembly method, significantly enhancing volumetric energy density while maintaining a compact footprint. By leveraging the abundant oxygen in the environment, the air cathode eliminates the need for onboard material storage, further improving energy efficiency. The core goal is to develop an on-chip microbattery with a footprint capacity exceeding 5 mAh/cm2 and a size under 1 mm2. To overcome the inherent challenges associated with zinc-air batteries, such as corrosion, bubble formation, and three-phase interface construction, we will combine detailed mechanism study with realistic numerical model to optimize electrode wettability, electrolyte composition, and cell configuration. Additionally, we will explore the integration of these microbatteries with various smart dust microsystems for demonstration. By achieving these goals, we can provide a reliable and high-performance power source for a wide range of smart dust applications, including environmental and agriculture monitoring, healthcare, and industrial automation. The successful development of this novel microbattery will have a profound impact on the field of microsystems and pave the way for the realization of advanced intelligent devices with unprecedented capabilities.

Оригинален текст от CORDIS (на английски).

Участници

• TECHNISCHE UNIVERSITAET CHEMNITZ · ChemnitzКоординаторГермания
• UPPSALA UNIVERSITET · UppsalaШвеция

Връзки

• Виж в CORDIS
• DOI: 10.3030/101268432