FP6Реинтеграция2007–2008

IDEE · Integrated dedicated electrostatic discharge and electro-magnetic interference protections for emerging-technologies applications

6РП — Действия „Мария Кюри“

Период
2007-04-01 → 2008-03-31
Финансиране от ЕС
40 000 €
Участници
1
Схема
ERG

Линиите свързват координатора с партньорите.

Накратко на български

Нови методи за защита на електрониката от статично електричество и електромагнитни смущения, като например при допир на човек до устройството, се проучват в проекта. Това помага за повишаване на надеждността на микрочиповете, които стават все по-чувствителни с развитието на технологиите.

Този кратък обзор е генериран от изкуствен интелект

Кратко обяснение, генерирано от езиков модел по текста на CORDIS. Оригиналът е по-долу.

Цел на проекта

Modern electronic devices play an increasing role in everyday life and have continuously increasing application domains. Electrostatic Discharges (ESD) and Electro-Magnetic Interferences (EMI) are increasing reliability concerns for electronic applications using advanced micro and nano-technologies. ESD failures are caused by the discharge of electrostatic charges present either on an external body, like humans or machines, or on the device itself.To cope with this problem, ESD protection circuits have to be provided at all pins of a device, to ensure that the discharge currents are safely conducted towards the ground. On the one hand, device susceptibility to EMI is measured by the maximum level of noise it can sustain up to operation failure or malfunction. On the other hand, a device can emit parasitic signal. Both noise emission and susceptibility of devices have to be minimized to obtain reliable applications.With the ever continuing scaling of technologies, the problem of ESD and EMI becomes more and more difficult to cope with since these technologies are more vulnerable to ESD and EMI with each new technology generation. New and original ESD/EMI protection techniques will be investigated in this project. A technology to build protection chips dedicated for ESD and EMI protection will be studied.It will take advantage of System in Package assembly techniques for the connection to the circuit to be protected. Moreover, new material having varistance properties and integrated in the final process phase (above IC) will open a new promising solution to overcome the limitation of current protection approaches in emerging technologies.The project will assist the applicant in professionally re-integrating his country of origin. The applicant will continue his career by joining the only academic research lab in France, involved in his research field, which has the full technology and characterization facilities to carry out this type of research.

Оригинален текст от CORDIS (на английски).

Участници

  • CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE · PARISКоординаторФранция

Връзки

Данни: CORDIS, © Европейски съюз